The battle between Huawei and TSMC in the AI chip arena is heating up as a new leak reveals critical differences between the Ascend 910B, manufactured by SMIC, and the original Ascend 910, produced by TSMC. Shared by tech analyst Kurnalsalts, the images provide a detailed look into the architectural changes that set these chips apart.
Comparing the AI Processors
The leak features die shots of three AI processors: the Ascend 910 (TSMC), the Ascend 910B (SMIC), and an unidentified Ascend 610 chip designed for AI applications.
Die shots, which expose the intricate design of an integrated circuit without external packaging, reveal that the SMIC-manufactured Ascend 910B significantly differs from its TSMC counterpart. While some similarities remain, notable distinctions exist, particularly in core size and count.
The SMIC-made Ascend 910B features a larger die layout and appears to integrate more and larger cores than the original Ascend 910.
Technical Breakdown: Ascend 910 vs. Ascend 910B
Both chips employ a multi-chiplet architecture, yet their design specifications diverge.
Ascend 910 (TSMC)
- Architecture: Virtuvian AI SoC
- Fabrication Process: N7+
- Die Size: 14.6 x 31.25 mm (456.25 mm²)
- Core Count: 32 DaVinci Max-AI cores (supports INT8 and FP16)
- Layout: Four clusters interconnected via a 1024-bit mesh NoC operating at 2GHz, providing 128GB/s bandwidth per core
- Memory: Four 1024-bit HBM2 interfaces and five die-to-die interfaces, including Nimbus and PCIe I/O
Ascend 910B (SMIC)
- Architecture: New DaVinci AI cores
- Fabrication Process: N+1 (7nm)
- Die Size: 21.32 x 31.22 mm (665.61 mm²)
- Core Count: 25 DaVinci AI cores
- Key Differences: Larger IC layout and new core architecture
Though the specifics of the New DaVinci AI cores are still unclear, early reports suggest they are compatible with code designed for the original DaVinci Max cores. The increased die size may stem from the new core design, although further details are needed to confirm this.
The Role of SMIC’s N+1 Process
SMIC has leveraged its N+1 fabrication process to produce the Ascend 910B. Despite being a 7nm technology, it introduces subtle improvements compared to TSMC's N7+.
Additional Observations
Alongside the 910 series, the leak also includes details of the Ascend 610. This chip features 16 general-purpose CPU cores, eight DaVinci Max cores, DaVinci mini cores, and a 192-bit LPDDR5 memory interface, further emphasizing Huawei's diverse AI chip portfolio.
Conclusion
The divergence between Huawei-SMIC Ascend 910B and TSMC Ascend 910 highlights the complexities of chip design and manufacturing. As Huawei continues to explore domestic manufacturing options, these differences could mark a pivotal moment in the company’s journey toward self-reliance in AI chip development.